Reliability Assessment for Trust Integrated Circuit Al Interconnections at Elevated Temperatures

The process of recrystallization occurring at temperature +80°C in aluminum (Al) conductors integrated circuits (IC) designed to operate the range -40°C -+60°C has been studied experimentally by method cross sections obtained with a focused ion beam (FIB). Using data comparative analysis IC used various operating conditions, mechanism electromigration caused supply voltage under influence elevated was revealed. Defects, substance, which appeared as result processes Al IC, were investigated. cause determined and technological solutions proposed improve reliability temperatures conditions when it is impossible change production. results can be for development well educational programs related microelectronics materials sciences.